Disentra Technologies

Disentra Technologies is a trusted expert in the field of mixed signal ASIC applications and semiconductor testing, offering tailored hardware-as-a-service solutions. Our expertise in packaging feasibility, thermal simulation, substrate design and system integration enables seamless testing of silicon samples and developing entirely new applications with them.
As experts in mixed signal ASIC applications, we have a deep understanding of the latest advancements in imaging technology. Our team can design and integrate camera systems that deliver exceptional image quality, resolution, and functionality. Whether it's for industrial, medical, or consumer applications, we have the expertise to create innovative camera solutions tailored to your needs.
We specialize in implementing Gig E Vision and SerDes communication protocols, enabling high-speed data transfer and seamless integration of cameras into various systems. Our engineers have extensive experience in developing robust communication interfaces that ensure reliable and efficient data transmission, even in harsh environments.
Our skilled engineers are proficient in schematic design and PCB layout, ensuring optimal circuit performance and manufacturability. We leverage the latest design tools and methodologies to create well-organized, highlyefficient PCB layouts that meet Military MIL industry standards and minimize signal interference.
Before delivering any hardware solution, we conduct product validation to ensure it meets the highest quality standards. Our validation process includes functionality testing, stress testing, and environmental testing to ensure that our products perform flawlessly in real-world conditions.
We focus on: Ultra high density BGA components with stacked micro vias and advanced materials.CPU, SOC ,FPGA with DDR memory cards SERDES PCB
Designs (LVDS, HDMI, USB-C etc.) Control units for 4G ,5G and Radar applications .PCB Designs for space, military, medical and commercial applications Extensive RF and analog design experience (printed antennas, guard rings , RF shields...) Memory ICs : DDR2, DDR3, DDR4 from 2gb to 64gb. Layer Stack up management and simulation for signal integrity and impedances control routing.